Process capability-明辉软硬电路,軟硬結合板（剛撓結合板）制造商

Process	project	Content	Conventional	Illustration
Cutting and splicing	Cutting and completing plate thickness	Number of layers	2-6 layers (layered board)
			2-10 layers (soft hard bonding board)
			Floors 1-8 (soft board)
		Cutting and splicing dimensions	250(220～400)mm 500(220～400)mm
		Complete board size (maximum)	480mm*380mm
		Complete board size (minimum)	5mm*8mm
		Maximum sheet thickness (double-sided copper)	0.3mm
		Minimum sheet thickness (single-sided copper content)	0.05mm (finished product)
	Other auxiliary materials	Specification of pressure-sensitive adhesive material	Pressure sensitive adhesive: 30/50/100/130um
		Specification of thermosetting adhesive material	Thermosetting adhesive: 12.5/15/25/40/50um
		PI reinforcement (excluding adhesive) material specifications	PI：1.0 - 13mil
		PET reinforcement (excluding adhesive) material specifications	White: 0.05-0.25mm
			Transparent: 0.025-0.25mm
		FR-4 reinforcement (excluding adhesive) material specifications	FR-4：≥50um
		Other types of reinforcement materials	Stainless steel, aluminum plate, nickel steel sheet according to customer requirements
	Common board materials	Material type	Single and double-sided adhesive Single and double-sided adhesive free and halogen-free Single and double-sided adhesive without halogen
		Copper thickness of substrate (electrolytic or rolled)	1/3oz 1/2oz 1oz 2oz
		Substrate PI	0.5mil,0.7mil,0.8mil, 1mil,2mil

working procedure

project

Content

Conventional

Illustration

Working edge size

Double sided tin deposition, gold deposition OSP、 Tinplate

TD direction 10/6mm, MD direction 6mm
(The clamp is fixed on the TD edge, 10mm)

Single and double-sided electric gold plates (250mm direction)

7mm

Single sided tin deposition, gold deposition, OSP board

Long side/short side ≥ 6mm

TFT products with fine fingers facing outward

Long/short side ≥ 7mm, and the clamping edge of TD side ≥ 10mm

Multi layer soft hard composite board

Long side/short side ≥ 12mm

drill hole

Drilling tolerance

Positioning tolerance

One drilling: ± 0.05mm

Secondary drilling: ± 0.1mm

Laser drilling (minimum blind hole)

Ø0.08mm

Laser drilling (minimum through-hole)

Ø0.05mm

Mechanical drilling aperture (minimum)

Ø0.1mm

Mechanical drilling aperture (maximum drill bit)

Ø6.30mm

Drilling hole (minimum)

Ø0.60mm

Finished hole diameter tolerance (plated through-hole)

±2mil(±0.05mm)

Finished hole diameter tolerance (non plated through-hole)

±1mil(±0.025mm)

Metalization of holes

Black hole PTH
/
electroplate

Minimum average copper thickness of PTH hole wall

Double sided panel: 10-18um

Module board (TFT): 8-15um

Soft hard combination board: ≥ 20um

Soft board multi-layer layered board: ≥ 16um

Control according to customer's special requirements

Producible size

250 or 500 * (220-400) mm

Graphic circuit

Minimum line width/line gap of film

Minimum hole ring (calculated within the inner layer of multi-layer board)

Limit 0.075mm (single and double-sided panels)
Conventional 0.1mm
Safety value 0.12mm

Unilateral 0.15mm (3, 4 layers), safety value 0.2mm

Unilateral 0.25mm (5, 6 layer board), safety value 0.3mm

Unilateral 0.35mm (6 or more layers)

Minimum hole ring (outer layer of multi-layer board)

Unilateral 0.1mm, safety value 0.15mm

Process

project

Content

Conventional

Illustration

Graphic circuit

Minimum line width/line gap of film

Minimum distance from NPTH hole to line

0.1mm, safety value 0.2mm (drilling)

0.15mm, safety value 0.25mm (steel die punching)

Minimum line width/gap of 1/3 OZ copper base

0.05/0.04mm (line compensated)

Minimum line width/gap of 1/2 OZ copper base

0.06/0.07mm (line compensated)

Minimum line width/gap of 1OZ bottom copper

Single panel: 0.07/0.08mm (line compensated)

Double sided board: 0.08/0.09mm (compensated circuit)

Minimum line width and spacing of the outer layer of the soft hard composite board

0.11/0.09mm (line compensated)

Minimum line width/line gap of multi-layer soft board

0.09/0.07mm (line compensated)

Etching compensation (overall): 1 OZ copper

0.03-0.04mm

Etching compensation (overall): 1/2 OZ copper

0.02-0.03mm

Etching compensation (overall): 1/3 OZ copper

0.015-0.02mm

Note: All independent lines shall be increased by 0.01-0.02mm (overall) on the basis of overall compensation; Minimum line spacing of 0.04mm

Dry film

Alignment tolerance

±0.05mm

Deviation of two-sided graphics (alignment overlap)

±0.05mm

Minimum Grid (Area)

0.2 × 0.2mm (preferably at a 45 ° angle)

Minimum grid line width/line spacing

0.15/0.15mm

Solder mask

Minimum distance from window to solder pad on one side

0.05mm, safe value 0.075mm

Minimum width of green oil bridge

0.1mm

Green Oil Bridge Cover Line with Large Single Side

0.05mm, safe value 0.075mm

Green minimum window

Ø 0.025mm, safety value Ø 0.04mm

Ink thickness

≥ 10um (usually 9-25um,
Guanpin thermosetting oil: 9-15UM

Minimum negative letter height/minimum line width for green oil

1.0/0.15mm

character

Minimum line width for positive text

0.1mm, safe value 0.13mm

Minimum line width for negative text

0.125mm, safety value 0.15mm

Minimum height of text

0.8mm

Minimum width of text

0.8mm

Process

project

Content

Conventional

Illustration

character

Minimum distance from characters to solder pads

0.15mm, safety value 0.25mm

Minimum line width of character line segments (non text)

0.1mm, optimal value 0.2mm

The minimum distance between character blocks and solder pads on one side

≥0.2mm

Minimum distance from characters to appearance

0.25mm

Carbon oil

Minimum carbon oil width/carbon oil spacing

0.25/0.3mm

Minimum distance from the outer edge

0.3mm

Carbon oil resistance tolerance (3000 Ω high resistance)

±400Ω

ACP
Conductive adhesive

ACP thickness range

15-25um

Number of conductive particles

＞ 30 pieces/mm ²

punching

Drilling accuracy tolerance

±1mil（0.025mm）

Fit together

Cover film processing

Minimum drilling hole for covering film window opening

Ø 0.4mm (drilling processing),
Safety value Ø 0.7mm

Minimum square window for covering film windows

0.6 × 0.6mm (steel mold processing)

0.5 × 0.5mm (precision die processing)

Minimum window spacing for covering film

0.5mm (precision mold), 0.2mm (laser engraving)

0.15mm (ordinary drilling)

0.2mm (slot, cross COV drilling bridge)

Minimum aperture for cutting cover film

0.7mm

Minimum aperture for cutting thermosetting adhesive and double-sided adhesive

1.0mm

Minimum window spacing for cutting cover film with cutting machine

0.15mm

Minimum window for cutting cover film with cutting machine

0.6*0.6mm

Minimum punching of covering film

0.6mm (steel mold processing)

Double sided adhesive window opening is larger than single-sided FPC

0.3-0.5mm

Distance from the edge of the cover film window to the edge of the solder pad or circuit

Products below 250 × 230mm: 0.05mm (safety value 0.1mm) Products above 250 × 230mm: 0.075mm (safety value 0.15mm)

Alignment tolerance of covering film and auxiliary materials

± 0.15mm, safety value ± 0.2mm

Excess glue amount of covering film (unilateral)

Conventional 0.08-0.12mm
Limit 0.03mm (TPX compression)

Electromagnetic film

SF-PC5000/5500/5900 black electromagnetic film minus release film thickness

22um/22um/9um

Process

project

Content

Conventional

Illustration

Fit together

Electromagnetic film

SF-PC1000 silver electromagnetic film minus release film thickness

32.1um

TSS200/TSS100 black electromagnetic film

22um/12um

electroplate

surface treatment

Nickel plating thickness

2.54-9um (conventional value 2-6um)

Plating thickness

0.025-0.2um
(Normal value 0.025-0.075um)

Nickel deposition thickness

1-6um (conventional 1-3um or 2-5um)

Thickness of gold deposition

0.025-0.125um
(Normal value 0.025-0.075um)

Tin plating thickness

3-10um

Tin deposition thickness

0.6-1.2um

OSP thickness

0.3-0.5um

Control according to customer's special requirements

Punching and cutting

Exterior cutting

Outline Tolerance

± 0.05mm (high-precision mold)
± 0.07mm (precision mold, etching knife mold)
± 0.1mm (ordinary steel mold, simple steel mold)
± 0.2mm (ordinary die)

Outer corner dimension (finger center to edge) tolerance

± 0.05mm (high-precision mold)
± 0.07mm (precision mold making)

± 0.1mm (for ordinary steel mold production and etching knife mold)

Sharp corners of the appearance are allowed to use transition rounded corners

R≥0.20mm

The minimum distance between the center of the positioning hole and the outer edge

2mm

Minimum distance between units

≥ 0.5mm (suitable for jumping, usually 1-2mm)

Boundary distance cutting line

≥ 2.0mm (die), ≥ 2.5mm (handmade)

Positioning hole (Ø 2.0mm) center distance from cutting line

≥ 2.5mm (die), ≥ 3mm (handmade)

Minimum diameter of semi-circular hole

0.25mm, safety value 0.3mm

Minimum distance from circuit to board edge

0.40mm (hand cut)

0.3mm (ordinary knife mold)

0.15mm (steel mold, etching knife mold)

0.1mm (precision die)

Process

project

Content

Conventional

Illustration

Punching and cutting

Exterior cutting

The minimum distance from the circuit to the board edge is 500mm, and there is no gap in the board arrangement

0.3mm (die)

V-cut
Milling plate V-CUT

Soft hard combination board

Diameter of gong and knife

Minimum Ø 0.8mm (minimum inner arc radius R0.4mm)

Pipe position hole

NPTH hole Ø 1.0mm

tolerance

Milling plate peripheral tolerance ± 0.13mm

Minimum distance from circuit to board edge

0.2mm (gong edge)

FR4 with the thinnest total thickness of V-CUT

0.3mm

The shallowest depth of V-CUT

0.08mm (oblique angle: 45 °)

test

Flying needle test

Minimum line width/spacing for flying needle test

0.05/0.05mm

Maximum height difference of test points

1.5mm

Finished product thickness

Finished product thickness tolerance (0.05-0.10mm)

±0.015mm

Finished product thickness tolerance (0.11-0.2mm)

±0.02mm

Finished product thickness tolerance (0.21-0.40mm)

±0.03mm

Multi layer soft hard composite board

Based on the specific layout structure

impedance

Impedance tolerance

Single point impedance tolerance

﹢/-10%

Differential impedance tolerance

﹢/-10%

Board type

Double sided panel (100/-10 ohms)

1MIL 1/3OZ non adhesive material
1.5MIL 1/3OZ non adhesive material
1/2MIL 1/3OZ with adhesive material

Multi-layer board

Match according to actual materials

SMT

Anti static level

class a

Dust free grade

100000 level

Minimum component

Conventional 0201, Extreme 01005

Minimum component spacing

Conventional 0.3mm, maximum 0.2mm

Minimum IC pitch

0.3mm

Minimum connector pitch

0.3mm

Minimum BGA pitch

0.3mm

Maximum layout size

Conventional 250 * 240mm limit 330 * 240mm

Maximum board surface step

Conventional ≤ 0.3mm Limit ≤ 0.35mm

Printing solder paste type

Lead free and halogen-free

Thickness of solder paste printing

120-180um

Process	project	Content	Conventional	Illustration
SMT	SMT	Minimum tinned area	0.3*0.25mm
		Solder height	Component height above 1/4
		Tin height on component pins	Greater than 1/2 of the component pin
		IMC alloy layer thickness	1-3um
		Number of temperature zones for hot air reflow soldering	10 temperature zones
		Reflow soldering temperature	Maximum 250 ℃
		Manual welding temperature	280-320℃
		Deviation tolerance of surface mount devices	±50um
		Connector alignment tolerance	±50um
		IC alignment tolerance	±50um
		LED alignment tolerance	±50um
		LED offset angle	1°
		LED parallelism tolerance	±50um
		AOI inspection capability	General: CHIP minimum: 0201, IC spacing: pitch=0.3mm； Limit: CHIP Minimum: 01005, IC spacing: pitch=0.3mm
		ICT testing	1200 points
		glue	UV glue, thermosetting glue, underfill (bottom filling)
		Excess glue tolerance for dispensing (dispensing side)	±50um
		Excess glue tolerance for dispensing (non dispensing side)	±50um